Product Design

We offer complete product design capabilities to achieve solutions for new and evolving product requirements. We provide an end-to-end solution that takes the product from design concepts and pilot builds, to production. We use proven methodologies to reduce costs, increase speed to market and establish highest possible product functionality and quality. We conduct a design feasibility study and team review via our stage-gate New Product Introduction (NPI) process. Our design Services Include:


Concept Co-creation

  • Defining requirements with your product team
  • Developing specifications
  • Gathering market data
  • Selecting technology
  • Developing firmware and software
  • Analyzing costs
  • Building the first prototype


Product Realization

  • Readying product for mass production via NPI
  • Evaluating for design robustness, manufacturability, BOM optimization


Lifecycle Management

  • Managing the product lifecycle with re-engineering and cost reduction
  • Ensuring lasting performance without compromising cost competitiveness or quality



  • System Architecture
  • Electrical Simulation
  • Design Calculations
  • Design for Manufacturing Analysis
  • Component Selection
  • Schematic & Layout Design
  • Software and Firmware
  • Mechanical Design
  • Product Testing and Certification
  • Re-engineering and Reverse Engineering
  • Development of fixtures & test jigs


Quick Prototyping

Our Zone of Autonomous Creation (ZAC) is a quick prototyping division that supports customers with small volume builds in shorter lead times. ZAC supports our clients by creating small volume prototyping quickly and efficiently. This division helps startups and other companies that need high-quality prototypes quickly produced at a low to medium volume under stringent process and quality control.

This service aids clients with shorter lead-time requirements and with a need to test multiple design revisions before mass-producing a product. For each prototype, we test for manufacturability and mass production via custom-developed functional and system-level testing. Our ideal delivery time target for each prototype is 4-6 weeks, subject to component availability.


PCB Assembly

We provide printed circuit board (PCB) assembly from our multiple manufacturing facilities. There are multiple Fuji SMT lines at our facilities. We manufacture boards up to 500x450mm with ceramic, flex, and rigid substrate board types. We also provide solder paste inspection, wave soldering, potting, conformal coating, back-end assembly, and testing. We invest in state-of-the-art electronic product assembly equipment that provides optimal capacity utilization, passing savings in time and cost to our customers.

PCBA Capabilities

  • Fine pitch placement up to 12 mil
  • Component ranges from 01005 BGA and uBGA, CSP up to 55 mm sq
  • ±25 micron placement accuracy with 3-Sigma capability
  • Board size: 534 x 610 mm
  • Board types: Rigid, Flex, Ceramic Substrate
  • SMT assembly in a class and dust-free zone
  • N2-enabled reflow soldering machines to produce high reliable solder joints
  • End-to-end traceability systems
  • Through-hole component assembly and dedicated product assembly line for volume builds
  • End-to-end traceability systems

PCBA Manufacturing Equipment

  • Screen printers – MPM Accuflex
  • Placement machines – Fuji, Universal, Yamaha
  • SPI Machines – Cyber Optics, KY 3020T
  • Reflow ovens – Electrovert, Heller
  • AOI – Cyber Optics, Agilent, Viscom, KY, Vitrox
  • Router/depanelizer (manual & automatic systems)
  • Traceability software – Fuji Trax
  • Conformal coating and UV check chambers
  • BGA repair station

Test Equipment

  • In Circuit Testers – Kyoritsu, Tescon
  • Manufacturing Defect Analyzers – TRI
  • 3D X-ray Inspection Systems
  • Customized automated test equipment
  • Environment & thermal shock chamber
  • Coordinate measuring machine – Mitutoyo
  • Profile projector (125Khz LCR meter)
  • Solder paste viscosity meter & height measurement
  • Video measuring machine
  • Vibration & bump tester


Box Build

We also provide complete box build, electromechanical assembly and full-systems integration services including including firmware, software loading, validation, testing and commercial or custom packing. We work with our supplier network to provide custom panels, electromechanical sub-assemblies, precision plastic molding, casting, machining and surface treatment.


Repair and Rework

We offer comprehensive PCBA repair and rework services ranging from refurbishment of the product to component level rework. Equipped with fully equipped repair and rework infrastructure, our IPC 7711/7211 qualified technicians offer the most complex types of modification services including circuit modification of outer and inner layers drill, etch, fill, and re-drill tooling holes. We specialize in failure analysis of electronic assemblies, printed-circuit-boards (PCBs), printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, LEDs, power modules, and many others.



Tester Development

We offer in-house tester development services. We design and assemble customized Automatic Test Equipment (ATE) based on customer’s test requirements and specifications. Our test development skill sets includes Hardware, software and firmware development for microcontroller, FPGA and DSP based products. We have developed testers for a wide range of products in Telecom, Automotive, RF, Consumer and Industrial sectors.