Aug 08, 2016
A global concept-to-product camera development services company sought an end-to-end manufacturing solution for the dense assembly of fine pitch camera imaging components, including leadless packages and system-on-module (SOM) for embedded camera modules, USB camera boards, and other specialized imaging uses, including advanced industrial machine vision and other automation applications.
We were tasked to manufacture the client’s products and sub-assemblies in compliance with each camera imaging component’s equipment data package (EDP). Many components required intricate assemblies within small footprints, including ultra-fine-pitch ball grid array (BGA), leadless lead-frame package (LLP), and multiple printed circuits linked by delicate wiring harnesses. For streamlined production and quality control, the client also required a comprehensive design failure mode and effect analysis (DFMEA) and process failure mode effects analysis (PFMEA) for every camera component to evaluate and eliminate potential manufacturing defects.
Our team used their product manufacturing expertise and worked closely with the client to develop durable, high-quality product prototypes. After conducting comprehensive DFMEA/PFMEA reviews for each product, our engineers recommended multiple enhancements for improved design and reliability. They reorganized and streamlined production methods, including adding an innovative QR code-based process for accelerated assembly of small-footprint circuit boards. Reviewing the client’s BOM expenses, they achieved significant cost savings, leveraging their global ecosystem of high-quality suppliers.
Our flexible manufacturing capabilities offered an optimal mix of the high-product mix at flexible volumes. We re-engineered the client’s camera packaging for lower freight costs while coordinating effective drop-ship retail distribution and adequate stock levels for online sales channels. Five years later, our engineering savvy, proactive collaboration, and manufacturing flexibility have enabled us to remain an integral EMS partner for this client’s expanding line of imaging products. We continue to introduce innovative new products to markets worldwide.
We contribute our 40 years of design and manufacturing expertise spanning multiple diverse markets. We look forward to discussing how we can deliver world-class products for OEMs across the globe. We understand our home Indian market, familiar with its vast regulatory and selling environments. We foster growth opportunities within India through our strong technology incubation ecosystem. We also assist global OEMs in entering the Indian market by leveraging the local supply chain and favorable operating environments for cost reductions.
Our flagship Chennai location opened in 2006 and lies within a Special Economic Zone (SEZ) for electronics manufacturing, offering economic incentives for imports and exports. This primary facility is within 90 minutes of the Chennai seaport and 20 minutes to the international airport. Additional road and rail connectivity links to the rest of India and beyond and infrastructure advantages with faster import and export clearances. We also have labor force flexibility, both technical and manual, to scale to demand rapidly.
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